PCB专业术语中英文汇总

2024-05-29 18:22| 来源: 网络整理| 查看: 265

一、标准流程名称

下料：CUT小站小站代码小站英文名称裁板MCUMaterial Cutting内层激光打码ILBInner Laser Barcode内层图形转移：IDF小站小站代码小站英文名称内层前处理ILPInner Layer Pre-Treatment内层贴膜IDLInner D/F Lamination内层涂覆ILCInner Liquid Coating内层曝光IEXInner Exposuring内层LDIIDIInner Laser Direct Image内层显影ILDInner Layer Development内层蚀刻IETInner Etching内层去膜IDSInner D/F Stripping内层显影/蚀刻/去膜IDESInner Developing, Etching, Stripping内层线宽测量QIDFIPQC for Inner D/FAOI：AOI小站小站代码小站英文名称内层离线AOIIOAInner Offline AOI内层AOIIAOInner AOI内层VRSIVRInner VRS内层入库WFIWarehouse for Inner Layers棕化：BOR小站小站代码小站英文名称PE冲孔OPEOPE Punching棕化BORBrown Oxide Replacement棕化后烘板BABBaking after Brown Oxide Replacement压合：LAM小站小站代码小站英文名称PIN 熔合PBOPIN BondingCCD熔合CBOCCD Bonding铆合RBORiveting & Bonding上铜块CCICopper Coin Inserting预叠PLUPre Lay Up叠板LUPLay Up压合PREPressing拆板UBOUnpacking Board分板DEPDepanelization裁磨PERPanel Edge Routing机械打码MBDMechanical Barcode DrillingPP开料PPCPP CuttingPP钻孔PPDPP Drilling激光钻孔：LAS小站小站代码小站英文名称X-RAY四孔钻靶XFHX-RAY Four HolesLDD棕化LORLaser Oxide Replacement激光钻孔LDDLaser Direct Drilling激光切割LKNLaser Cutting激光钻孔质量检测QLASIPQC for Laser通孔钻孔：DRL小站小站代码小站英文名称钻对位孔THDTarget Holes DrillingX-RAY三孔钻靶XTHX-RAY Three Holes上PIN包胶APFAuto PIN Fixing机械钻孔DRLMechanical DrillingPOFV钻孔MDHMechanical Drilling POFV Hole钻孔后一次铣1RAD1st Routing after Drilling铜块钻孔检查CHCCoin Hole Checking退PINPINRPIN Removing去毛刺：DEB小站小站代码小站英文名称去毛刺DEBDeburring高压水洗HPRHigh Pressure Rinsing去毛刺后检孔HCAHole Checking after Deburring控深钻：DCD小站小站代码小站英文名称C面控深钻孔DDTDCD from Top SideS面控深钻孔DDSDCD from Bot SideC面背钻钻孔BDTBack Drilling from Top sideS面背钻钻孔BDBBack Drilling from Bot side图电后一次铣1RAP1st Routing after Pattern Plating图电后二次铣2RAP2nd Routing after Pattern Plating二次控深钻：2DCD小站小站代码小站英文名称C

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